AMD's Ryzen 7 9800X3D teaser material has been circulating with the buzzwords "X3D Reimagined," sparking curiosity among enthusiasts. According to leaks from 9550pro, a reliable source for hardware information, AMD has made significant changes to the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked in the upcoming processor.
In previous X3D processor generations like the 5800X3D "Vermeer-X" and the 7800X3D "Raphael-X," the L3D was traditionally stacked on top of the CCD. However, with the 9000X3D series, AMD has flipped this arrangement so that the "Zen 5" CCD is now on top, with the L3D positioned below it. This new configuration allows the CPU cores to dissipate heat to the integrated heat spreader (IHS) more efficiently, similar to regular 9000 series processors.
It is speculated that AMD achieved this by enlarging the L3D to match the size of the CCD, creating a "base tile" that is peppered with through-silicon vias (TSVs) to connect the CCD to the substrate below. Currently, the L3D "base tile" houses the 64 MB 3D V-cache, which complements the existing 32 MB on-die L3 cache. In the future, AMD may extend this design to include TSVs for per-core L2 caches, possibly in the "Zen 6" architecture.
This new stacking method not only enhances thermal performance but also opens up possibilities for higher clock speeds and overclocking capabilities in X3D processors. With fewer thermal obstacles, AMD can potentially offer the same power and clock speed targets for X3D chips as their non-X3D counterparts, leading to improved performance.
AMD is set to unveil the Ryzen 7 9800X3D on November 7, 2024.
