The highly anticipated AMD Ryzen 7 9800X3D processor has been examined by hardware modders, who have conducted a de-lidding process to uncover its internal components. The de-lidded image of the 9800X3D shows a plain CCD without any visible L3D on top, which is different from the 7800X3D. There have been rumors suggesting that AMD has reconfigured the stacking arrangement of the 3D V-cache die (L3D) and the CPU complex die (CCD) in the 9000X3D series, with the CCD now positioned above the L3D.
In previous X3D processor models like the 7800X3D and the 5800X3D, the L3D was placed on top of the CCD, with structural silicon responsible for transferring heat from the CPU cores to the integrated heatspreader (IHS). This new stacking arrangement is expected to improve thermal performance for the CPU cores, resulting in behavior similar to non-X3D chips like the 9700X. The 9800X3D has a TDP of 120 W and a boost frequency of 5.20 GHz. This change in stacking configuration is likely the reason behind AMD's "X3D Reimagined" teaser.
