News & Articles

Specifications for the ASUS ROG Ally X have been confirmed, including 24GB LPDDR5X-7500, M.2-2280, and an 80Wh battery.
Specifications for the ASUS ROG Ally X have been confirmed, including 24GB LPDDR5X-7500, M.2-2280, and an 80Wh battery.
The leaked specs sheet of the upcoming ASUS ROG Ally X handheld game console confirms a larger M.2 drive bay, 1 TB drive, 80 Wh battery, improved memory, and USB4 type-C connectivity, making it a significant upgrade from the ROG Ally Extreme.
G.Skill has officially released the Trident Z5 Royal Series DDR5 Memory.
G.Skill has officially released the Trident Z5 Royal Series DDR5 Memory.
G.SKILL International Enterprise Co., Ltd. unveils the Trident Z5 Royal series of high-performance overclock DDR5 memory, featuring a luxurious design with a mirrored-finish heat spreader and crystalline light bar, set to be released in late May 2024 with Intel XMP 3.0 support.
The G.Skill Trident Z5 Royal DDR5 Memory Series is shown in the picture.
The G.Skill Trident Z5 Royal DDR5 Memory Series is shown in the picture.
G.Skill is set to launch its highly anticipated Trident Z5 Royal DDR5 memory series, featuring a luxurious design and high-speed capabilities, at an upcoming event next month.
G.Skill reveals plans for OC World Record Event 2024 in conjunction with new product releases.
G.Skill reveals plans for OC World Record Event 2024 in conjunction with new product releases.
G.SKILL International Enterprise Co., Ltd. is set to unveil new DDR5 memory, peripherals, and PC cases at Computex 2024, along with hosting the 10th Annual OC World Record Stage, 8th Annual OC World Cup, and 4th Annual Extreme Mod Stage for PC enthusiasts and overclocking enthusiasts alike.
Synopsys states that PC DDR6 Memory will provide ten times the bandwidth of DDR4.
Synopsys states that PC DDR6 Memory will provide ten times the bandwidth of DDR4.
The upcoming DDR6 memory standard promises a 10-times increase in bandwidth over DDR4, with speeds starting at DDR6-8800 and reaching up to DDR6-17600 in the first generation, set to be finalized by mid-2025, alongside LPDDR6 for low power devices.
TSMC reveals new HBM4 base dies, constructed using 12 nm and 5 nm technology nodes.
TSMC reveals new HBM4 base dies, constructed using 12 nm and 5 nm technology nodes.
TSMC's announcement at the European Technology Symposium 2024 reveals plans to manufacture next-generation HBM4 base dies using 12 nm and 5 nm nodes, promising improved performance, power consumption, and logic density for high-performance computing and artificial intelligence applications.
During the IEEE IMW 2024 in Seoul, NEO Semiconductor unveils a floating body cell mechanism that enhances the performance of 3D X-DRAM.
During the IEEE IMW 2024 in Seoul, NEO Semiconductor unveils a floating body cell mechanism that enhances the performance of 3D X-DRAM.
NEO Semiconductor introduces groundbreaking Back-gate Channel-depth Modulation mechanism for Floating Body Cell in 3D X-DRAM, promising significant improvements in data retention and sensing window during the 16th IEEE International Memory Workshop (IMW) 2024 in Seoul, Republic of Korea.
Micron supplies essential LPCAMM2 featuring LPDDR5X memory for the AI-capable Lenovo ThinkPad P1 Gen 7 Workstation.
Micron supplies essential LPCAMM2 featuring LPDDR5X memory for the AI-capable Lenovo ThinkPad P1 Gen 7 Workstation.
Micron Technology, Inc. introduces LPCAMM2, a revolutionary laptop memory form factor with LPDDR5X mobile memory that offers higher performance, lower power consumption, and space savings compared to DDR5 SODIMMs, making it an ideal solution for professionals and creators using Lenovo ThinkPad P1 Gen 7 mobile workstations.
Samsung and AMD have agreed to a $3 billion supply deal for HBM3E 12H.
Samsung and AMD have agreed to a $3 billion supply deal for HBM3E 12H.
Samsung Electronics signs $3 billion agreement with AMD to supply HBM3E stacks for AI and HPC accelerators, giving insight into the volumes of AI GPUs AMD is preparing to push into the market and potentially impacting NVIDIA's use of HBM3E made by SK Hynix.
SMART Modular Technologies has launched a new line of CXL Add-in Cards for expanding memory.
SMART Modular Technologies has launched a new line of CXL Add-in Cards for expanding memory.
SMART Modular Technologies, Inc. introduces new high-density DIMM Add-In Cards (AICs) implementing the CXL standard, offering up to 4 TB of memory capacity for server and data center applications, with industry experts predicting rapid market growth and adoption rates.